Abstract:
It is shown that structured substrates having micron- or submicron-sized through holes and coated with an ultrathin organic film can be used for the fabrication of thin-film X-ray filters via direct growth of functional layers on a substrate by sputter deposition, without additional complex processing steps. An optimised process is considered for the fabrication of X-ray filters on support structures in the form of electroplated fine nickel grids and on track-etched polymer membranes with micron- and submicrondiameter through pores. 'Optimisation' is here taken to mean matching the sputter deposition conditions with the properties of substrates so as to avoid overheating. The filters in question are intended for both imaging and single-channel detectors operating in the soft X-ray and vacuum UV spectral regions, at wavelengths from 10 to 60 nm. Thermal calculations are presented for the heating of ultrathin layers of organic films and thin-film support substrates during the sputter deposition of aluminium or other functional materials. The paper discusses approaches for cooling thinfilm composites during the sputter deposition process and the service of the filters in experiments and gives a brief overview of the works that utilised filters produced by the described technique on microstructured substrates, including orbital solar X-ray research in the framework of the CORONAS programme and laboratory laser plasma experiments.
Citation:
A. V. Mitrofanov, “Thin-film X-ray filters on microstructured substrates and their thermophysical properties”, Kvantovaya Elektronika, 48:2 (2018), 105–114 [Quantum Electron., 48:2 (2018), 105–114]
Linking options:
https://www.mathnet.ru/eng/qe16766
https://www.mathnet.ru/eng/qe/v48/i2/p105
This publication is cited in the following 5 articles:
A. V. Mitrofanov, R. M. Feshchenko, Tech. Phys., 69:5 (2024), 1282
Bull. Lebedev Physics Institute, 51:suppl. 5 (2024), S416–S423
A. V. Mitrofanov, R. M. Feshchenko, Bull. Lebedev Phys. Inst., 49:6 (2022), 169
V. Nazmov, B. Goldenberg, A. Vasiliev, V. Asadchikov, J. Micromech. Microeng., 31:5 (2021), 055011